ChipFill® - Hot applied surface defect repair

ChipFill® - hot applied surface defect repair system

ChipFill® is a specially designed thermoplastic for repairing cracks and smaller holes with a diameter around 15-20 cm. Reparations made with ChipFill® minimises the risk of defects getting bigger, and can be done in only 20 minutes.

Handling of ChipFill® is easy and effective

The hot applied thermoplastic gives better bonding to the underground compared to cold applied repair systems. When heated, the binders in the thermoplastic bond to the bitumen in the asphalt.

ChipFill® is a temporary solution that keeps the cost down by avoiding water from going into the underground and making the holes, cracks and damages bigger.

When working with ChipFill®, there is no need for big bulky machinery. You can have it on your vehicle and easily repair smaller holes or cracks as you see them. All you need is a brush and a gas burner and you are ready to repair on-the-go.

ChipFill® can be applied all year round

ChipFill® is easy to use and apply. Use a stiff brush to clean the hole or crack and preheat the area with a propane gas burner. Fill in a layer of ChipFill® of maximum 15 mm and heat the material with the gas burner. The heated ChipFill® will start to be fluent and follow the contexture of the hole or crack. If this is deeper than 15 mm, it is important to let the layer set before applying another layer on top of the first one. In order to achieve the best result, the maximum depth should not exceed 45 mm.

You can secure initial skid resistance and avoid ghost markings by post-sprinkling the ChipFill® surface with anti-skid aggregates while the material is still hot.